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GRM602 Multi-Stage Roots Dry Vacuum Pump 600 m³/h Oil-Free Medium-Capacity Vacuum Pump for Semiconductor Process

GRM602 Multi-Stage Roots Dry Vacuum Pump 600 m³/h Oil-Free Medium-Capacity Vacuum Pump for Semiconductor Process

Product Details:
Place of Origin: China
Brand Name: Baosi
Certification: CE
Model Number: GRM601
Detail Information
Place of Origin:
China
Brand Name:
Baosi
Certification:
CE
Model Number:
GRM601
Pumping Speed:
600 M³/h
Ultimate Pressure:
≤0.15 Pa
Motor Power:
1.9+1.9 KW
Voltage:
380V/3-Phase
Inlet:
ISO100
Outlet:
KF25
Noise:
≤63 DB(A)
Weight:
260 Kg
Dimensions:
865×344×751 Mm
Cooling Water:
0.1-0.6 MPa, ≥4 L/min
N2 Purge:
0.2-0.6 MPa, 12-50 L/min
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GRM602 oil-free dry vacuum pump

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multi-stage roots vacuum pump

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semiconductor process vacuum pump

Trading Information
Minimum Order Quantity:
1 Set
Price:
Negotiable
Packaging Details:
Export Standard Wooden Case Packaging
Delivery Time:
15-30 Working Days
Payment Terms:
T/T
Supply Ability:
50 Sets/Month
Product Description

GRM602 Multi-Stage Roots Dry Vacuum Pump — 600 m³/h Medium-Capacity Solution

The GRM601 is a medium-capacity multi-stage roots dry vacuum pump delivering 600 m³/h pumping speed with an impressive ultimate pressure of ≤0.15 Pa. Its dual 1.9+1.9 kW permanent magnet synchronous motors provide reliable oil-free vacuum for semiconductor, photovoltaic, and lithium battery applications.

Key Features

  • Multi-Stage Roots Design: High pumping speed with low power consumption
  • Dual Motor Configuration: 1.9+1.9 kW for balanced, efficient operation
  • Ultra-Low Ultimate Pressure: ≤0.15 Pa for demanding process requirements
  • Ultra-Quiet: ≤63 dB(A) — ideal for cleanroom environments
  • Oil-Free Mechanism: Zero oil contamination for sensitive processes
  • Superior Particle Handling: Advanced rotor structure for dusty processes
  • Compact Integration: 865 * 344 * 751 mm, 260 kg
  • Dust & Vapor Insensitive: Reliable with process byproducts and moisture
  • Advanced Sealing: Lip seal + labyrinth + nitrogen purge protection
  • Remote Intelligence: I/O and RS485 (Modbus) for factory automation

Technical Specifications

Model GRM602
Pumping Speed 600 m³/h
Ultimate Pressure (w/o purge) ≤0.15 Pa
Motor Power 1.9 + 1.9 kW
Voltage 380V (3-Phase)
Inlet Connection ISO100
Outlet Connection KF25
Noise Level ≤63 dB(A)
Weight 260 kg
Dimensions (L*W*H) 865 * 344 * 751 mm
Cooling Water Pressure 0.1–0.6 MPa
Cooling Water Flow ≥4 L/min
N₂ Purge Pressure 0.2–0.6 MPa
N₂ Purge Flow 12–50 L/min
Operating Temperature 5–40°C; ≤90% RH

Applications

  • Semiconductor: PECVD, MOCVD, SACVD, RTP, HDP-CVD, ALD, Metal Etch, Silicon Etch
  • Photovoltaic: Crystal growth, solar cell manufacturing
  • Lithium Battery: Cell drying, electrolyte filling, degassing
  • Flat Panel Display: LED and LCD manufacturing processes